IDF Fall 2003: Next-gen Centrino processor takes a bow

By Alun Williams

Posted on 18 Sep 2003 at 09:46

Intel has been showcasing its next-generation processor, which will appear under the Centrino banner.

Codenamed Dothan, it will replace the Banias core of the current Pentium-M processor. It contains 140 million transistors, 2MB of level 2 cache, improved register data retrieval and has a more efficient data pre-fetcher.

The processor will be also notable for being the first to be produced on Intel's new 90nm process using 300mm wafers. As well as reduced production costs, this new production capability produces smaller, more-efficient dies. It will also be the first to employ a strained silicon technique.

How does straining silicon actually achieve performance gains? The analogy that Intel's director of Mobile Marketing, Don Macdonald, drew for us involved shopping malls. Trying to get from one end to the other can be difficult when the place is crowded. So it is with signals making their way across the silicon. By straining the silicon, and separating atoms, signals can actually pass within the processor more easily.

Expect Dothan to be introduced before the end of the year.

Also showcased was Sonoma, the next generation Centrino platform. As well as incorporating the Dothan processor, 802.11 a/b/g WLAN support, it will feature a new chipset codenamed Alviso.

This will support PCI Express, PCI Express Cards, DDR2 memory, Serial ATA and Intel's Azalia audio interface (replacing AC97, and achieving a 50 per cent reduction in power for audio processing).

Sonoma will not be implemented before the second half of 2004.