Intel announces stacked flash memory for mobile phones

By Steve Malone

Posted on 11 Apr 2003 at 10:46

Chip giant Intel has enhanced its range of flash memory products which can support five ultra-thin memory chips.

The company says the new flash memory can be stacked for greater memory capacity, lower power consumption and all in a smaller space. Intel expects the products to feature in the next generation of mobile phones.

The snappily titled Ultra-Thin Stacked Chip-Scale Packaging (CSP) features 1.8 Volt StrataFlash Wireless Memory, which Intel envisions will improve a phone's camera capabilities, and support games and email in relatively thin units. To cope with the expected demand, Intel says it has introduced new high-volume manufacturing techniques.

These stacked-CSP devices will allow up to five stacked die with package heights as low as 1.0 mm. The products feature 16-bit and 32-bit buses as well as SRAM, PSRAM and LP-SDRAM options. The products will offer up to 512 Mbits of flash memory this year and 1 Gbit of flash memory by next year.

Intel says that production volumes will be available in Q3.